Technology Partners

Insight SiP optimizes the technology choices to meet customer requirements in terms of size, cost and time-to-market. The design & manufacturing of highly integrated RF systems and sub-systems proposed by Insight SiP is based on:

  • System in package approach
  • Ability to integrate any technology: PCB, LTCC, Thin film, Thick film…
  • Major semiconductor manufacturers

Insight SiP has access to world leaders design rules for each SiP manufacturing technology and packaging, allowing us to select the most effective combination of process and production partner for each project we are working on:

  • Assembly
  • Laminate
  • IPD
  • LTCC
  • Design Houses

More about
Amkor
. . .
More about
AT&S
. . .
More about
Beckermus
. . .
More about
DT Microcircuits
. . .
More about
EnSilica
. . .
More about
E-tec
. . .

More about
Ipdia
. . .
More about
Infineon
. . .
More about
Kinsus
. . .
More about
Kyocera
. . .
More about
Spil
. . .
More about
ST Microelectronics
. . .

More about
Subtron
. . .
More about
Teledyne e2v
. . .
More about
Tong Hsing
. . .
More about
Unimicron
. . .
More about
Unisem
. . .

CONTACT US

Insight SiP
GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

Phone: +33 (0) 493 008 880

Privacy Policy :: Legal Notice

OFFICE

NEWSLETTER

Please enable the javascript to submit this form