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FAQs

What is the difference between Insight SIP modules and competitor devices?

At Insight SIP we are experts in System in Package and Antenna in Package technology. We use this almost exclusively in our products, and have invested many years of R&D in perfecting this approach. The result is very small devices made in high quality manufacturing environments. We also have deep expertise in RF systems, and have been working on complex RF problems for nearly 20 years. We are specialists in RF devices and as such believe we offer a unique focus on providing best in class devices in this category. Further details are available here about our System-in-Package and Antenna-In-Package technologies.

We manufacture with a number of OSATs (Outsourced Assembly and Test) houses, which are in various locations including Taiwan, Philippines and Thailand. Due to the nature of the SIP process, our products are manufactured in high grade clean rooms following a highly structured process. We do not manufacture in the mainland Republic of China.

Each module is individually tested in the factory for electrical connections and RF functionality, and also subject to manual visual inspection. We therefore have an extremely low return rate of our products due to this rigorous testing regime.

All of our products are “open”, meaning that customer firmware can be loaded on to the product. Sometimes this needs to be integrated with software stacks provided by either ourselves or our chipset manufacturer partners. We can pre-load customer applications into our modules in our factories as an additional service, although we only recommend doing this once the customer application has reached a good level of stability.

There are various types of certifications. The most important is radio certification. This ensures that the module is compliant with radio transmission regulations (which vary by territory). This covers such topics as ensuring the module is transmitting in the right band, and does not transmit above permitted limits at out of band frequencies. Having a pre-certified module greatly simplifies the process of bringing the customer product to market, as it is easy to make mistakes even if following a reference design from a chipset vendor. Our modules are certified for EU, UK, USA, Japan and Korea in all cases, and some modules are also certified for other territories such as the Republic of China. Only a module with antenna and RF matching (thus making a complete RF node) can be radio certified. In addition, there can be certification for specific radio protocols such as Bluetooth, where the certification ensures interoperability and allows devices to be marketed as Bluetooth compliant.

With all of our modules, you activate the internal antenna(s) by connecting the adjacent pins OUT_MOD and OUT_ANT. The vast majority of customers use our modules in this way. However it is perfectly possible to use an external antenna by running a 50 ohm line from the OUT_MOD pin to the external antenna. See the relevant data sheet for the product in question for more details. In such a case, it is no longer possible to rely on the certification of the module in territories that demand over the air testing.

Our products are moisture sensitive, which means there is a restricted time for which they can be exposed to a normal atmosphere prior to assembly. Our products are delivered in sealed packs, and the Moisture Sensitivity rating (mostly MSL-3, but specified on each product data sheet) determines how long they can be left in a normal atmosphere before assembly. If this time is exceeded, the modules need to be re-baked before assembly. Full details are available by consulting the relevant JEDEC standards on moisture sensitivity.

Insight SIP is an independent company and has no exclusive ties with any chipset vendor. We chose to work with technological and market leaders in the different segments where we offer products. We currently offer products based on the silicon provided by Nordic Semiconductor, NXP, Qorvo and Semtech.

We have an online Shop where small quantities of our modules and development kits and tools can be purchased. For larger volume purchases, we work through our global network of Distributors who can assist customer with such purchases and arranging planned shipments to meet manufacturing schedules.

Samples of all standard catalogue modules can be purchased in small quantities through our online Shop, with a typical minimum order quantity ot 10pcs. For production volumes we recommend working with one of our Distributors or contacting us directly, so we can plan manufacturing and lead times around your schedule.

Yes. For every module we provide a design tools including schematic symbol, PCB footprint, and 3D model, together with application notes covering recommended PCB stack-up, decoupling and RF layout.

The antenna area must be kept free of copper, components and other conductive elements on all layers, and should ideally overhang the edge of your board with an uninterrupted ground plane directly beneath the rest of the module. Keep high-speed and noisy digital traces away from the antenna keep-out zone, and avoid placing the module close to metal shielding, connectors or a metal enclosure, since this can detune the antenna and reduce range. The exact keep-out dimensions and recommended placement are given in the datasheet and layout application note for each product.

Modular certification is only valid when the module is used exactly as certified. Using an external antenna, adding metal shielding, or enclosing the product in a case that sits within the antenna’s near field can change its RF performance. If you plan to use an external antenna, we recommend contacting us early.

Depending on the chipset inside the module, we provide access to the relevant vendor SDK (for example Nordic’s SDK or nRF Connect, or NXP’s, Qorvo’s and Semtech’s own toolchains), together with our own application notes, AT command sets where applicable, and example projects. Development kits are available for all our modules so you can start evaluating functionality before committing to your own hardware design.

Our modules contain ESD-sensitive components and should be handled at an ESD-safe workstation using standard precautions such as wrist straps and grounded mats. Modules are shipped in moisture barrier bags with desiccant and a humidity indicator card; once a bag is opened, the floor life shown on the moisture sensitivity label applies, after which the modules must be re-baked before reflow.

Our modules are qualified for standard lead-free reflow soldering in line with the applicable JEDEC J-STD-020 profile; the exact peak temperature and time above liquidus for each product are given in the datasheet. Hand soldering and rework are possible but must be done carefully, respecting the same peak temperature limits, since the module contains fine-pitch and moisture sensitive components.

We design our roadmap around the long product lifecycles typical of industrial, medical and professional applications, and aim to keep modules in production for many years. Where a product does need to be discontinued, Jedec Standard JSD-48 will be followed. A Product Discontinuation Notice (PDN) will be sent to all distributors and made available on our website. After this, the procedure goes as follows: –

  • Last Order Date will be 6 months after the PDN was published.
  • Last Shipment Date will be 6 months after Last Order Date, i.e. 12 months after PDN.

This allows customers time to qualify a replacement. Furthermore most of our BLE modules have pin-to-pin compatibility on core functions) or place a final order.

Yes, our products are RoHS and REACH compliant. Certificates of compliance and other quality documentation are available on request or via our website for each product.

Many of our modules are already used inside medical and other regulated end products. Because the regulatory requirements for the finished device depend on its intended use and target market, we recommend discussing your specific application with us early in the design process so we can advise on the relevant module certifications and any additional testing your end product may require.

Yes. Our application engineers can support you through schematic and layout review, antenna and RF matching questions, firmware integration, and troubleshooting during bring-up and pre-compliance testing, helping you avoid common integration mistakes and keep your project on schedule.

Yes. In addition to our catalogue products, we can develop custom or semi-custom SIP and AiP modules for customers with sufficient volume requirements, for example combining a specific chipset with a tailored antenna, form factor, or feature set to match your application. For more information on this topic, see Custom modules