Insight SiP has a diverse client base which includes tier one OEM’s, leading chipset vendors and hi-tech innovative startup companies. Insight SiP serves the market with creative packaging solutions to customers who need highly integrated systems to meet wireless and portable devices space requirements. Experts in custom multi-die RF circuit miniaturization, System-in-Package (SiP) and Antenna-in-Package (AiP) designs, Insight SiP also provides ready-to-use RF modules for low power connectivity applications such as telecom and mobile computing, portable consumer devices, healthcare, automotive – connected cars, industrial, Internet-of-Things (IoT).
Insight SiP has designed a series of ultra-miniature wireless modules for various applications such as 3G, 4G/LTE, 60Ghz, ANT, Antenna Tuning, Bluetooth Smart, Bluetooth, GSM/W-CDMA, GPS/Glonass, ISM, NFC, RFID, Wireless Sensor Modules, Software Define Radio, Transfer Jet, Ultra-miniature Antennas, UMTS, UWB, WHDI, Wifi, WLAN, Zigbee …
Each industry has its own unique challenges and opportunities. So Insight SIP creates unique solutions, geared to mobile phone industry, to help you take full advantage of the System-In-Package approach so you can transform your business.
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Deliver a seamless experience
As mobile devices become an integral part of daily life for customers, it’s critical to deliver experiences that feel seamless. That’s why some of the mobile computing industry’s most influential companies count on Insight SIP to deliver highly integrated systems to meet portable and wireless space requirements every step of the way.
Low Power Front-end Modules
Thanks to its unique design methodology, Insight SiP has developed very low power solutions which are key for the latest smartphones, using optimized switching techniques extending the battery life time. Several filter designs (from 300MHz to 40GHz) have been designed internally for major phone manufacturers or EMS.
With the increasing number of features, more and more functions need to be integrated into the future portable devices. This leads to some further miniaturization, to overcome the size or weight increase. System-in-package is one of the answers to address this challenge, by embedding functions like ASIC, microcontrollers, memories, power management units, MEMs, ADC-DAC, etc.
Insight SiP has worked directly with major car manufacturers or car equipment manufacturers on applications linked to audio infotainment, GNSS (GPS, Glonass). Several system-in-package or mutli-chip modules have been designed and released from prototyping to production. Latest projects are now addressing the emerging smart-secure requirements for RKE (Remote Keyless Entry) systems.
As multi RF protocols needs to be supported within the car body or RKE, Insight SiP has proven strong expertise in smart antenna designs (3G / 4G / WiFi / FM/ GNSS / DAB) featuring ultra-miniature topology while eliminating RF signal interference.
Insight SiP has worked with the major M2M module providers, delivering solutions for cellular (GSM, 3G, 4G, LTE, LTE-Cat1, LTE-M). Activities span from design, prototype deliveries to production or licensing business models. Those modules can be used in applications like smart-grid, smart-meters, or energy harvesting.
Insight SiP has established a strong partnership with worldwide packaging/assembly/test manufacturers (in particular in Asia and Europe) which can support specific environmental qualification criteria. They will address the extreme industrial conditions like temperature, humidity, mechanical stress, shock absorption, etc.
Low Power and Miniaturization
As the number of devices to be connected is growing exponentially, it is essential to develop products which are small enough, and which do not require battery replacement on a regular basis. Insight SiP has the perfect solution in Low Power product development (thanks to its well-known strong RF front end module exterise in smartphone applications). Key benefits are limited maintenance, environmental friendly (energy harvesting integration) and lower cost devices.
Sensor devices need to communicate in a mesh network, amongst different clusters or thru gateways to the cloud. Easiest implementation is to do it using wireless technologies like Bluetooth Smart (BLE), Beacon, ANT, ZigBee, NFC, RFID, WLAN, LPWAN (SigFox, LoRa, NB-IoT, LTE-M). Insight SiP has integrated all those RF protocols from prototyping to production and is well positioned to address customer particular connectivity needs.