Product samples available from stock.
For more quantity, please consult us.
All shipments are Ex Works. Shipment service provided if needed.
Delivered in standard tray from 15 to 99 units. These parts are MSL Level 5 and must be baked before assembly.
Delivery in Jedec tray with sealed pack, desiccant and humidity sensor for multiple of 100 units.
This LGA module, 8 x 12 x 1.5 mm, is based on the nRF8001 µBlue Chip. Combined with an external MCU, this module integrating an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. SPI and UART interfaces are available for easy communication and give the opportunity to add BLE connectivity to any designs.