Bluetooth Low Energy V4.2 Compliant - ISP1302 High Performance Module

Lite Bluetooth Low Energy Module with MCU and Antenna


Features | Applications | Block Diagram | Main Specifications | Product User Guide |Dev Zone


This ultra-small LGA module, 8 x 8 x 1 mm, is based on the nRF51822 Chip. Its powerful Cortex™ M0 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. Multiple digital and analogue interfaces give optimum flexibility for sensor integration.

The ISP1302 Bluetooth Low Energy module is Insight SIP’s offer for customers who want the lowest cost BLE Module, whilst still benefiting from Insight SIPs miniature module technology, and Nordic Semiconductor’s class leading Bluetooth chips V4.2 Compliant.

Based on the nRF51 series chipset, this Bluetooth Smart Module offers good low power consumption coupled with excellent radio performance from the integrated antenna.

This BLE module is the ideal choice for customers who are looking at large volume production, are cost conscious, and are running compact applications on the Bluetooth node.


  • Connected sensors for medical devices, healthcare, sport, fitness, industrial …
  • IoT applications, connected objects
  • Wearable technology
  • Home automation
  • Beacons
  • BLE connectivity for any existing application

Block Diagram

This module is based on nRF51 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC). It can support Bluetooth Low Energy and 2.4GHz proprietary ultra low-power wireless protocols. Related stacks are provided with SoftDevice S100 series for Central, Peripheral or both roles for BLE.

ANT protocol and other memory size can be available on request.

Main Specifications

  • Single Mode BLE V4.2 Compliant
  • IPv6 Connectivity
  • ECDH Encryption
  • Based on Nordic Semiconductor nRF51
  • 2.4GHz low energy RF Transceiver
  • 32bit ARM Cortex M0 CPU
  • 128 kB or 256 kB Flash, 16 kB SRAM
  • 16 GPIOs including 5 ADC & 1 Ref inputs
  • Ultra small size 8.0 x 8.0 x 1.0 mm
  • Fully integrated RF matching and Antenna
  • Integrated 16 MHz Clock
  • Possibility to connect external 32.768 kHz
  • Possibility to enable DC-DC converter
  • Operating Conditions
    • Supply voltage 1.8 to 3.6 V
    • Temperature range -40 to +85°C
  • Power Consumption
    • Peak current, Rx active 12.6 mA
    • Peak current, Tx active 10.5 mA
    • Deep sleep current 0.6 µA
  • Clock Sources
    • Internal HF clock, 16 MHz crystal
    • Frequency tolerance +/- 40 ppm
  • Radio Specification
    • Frequency range 2402-2480 MHz
    • Rx sensitivity -93 dBm
    • Antenna gain 0.6 dBi
    • Range open field 100 m typ
    • Data rate up to 2 Mbps

Product User Guide

  • Ordering Information
    • ISP1302-BM-ZZ
      BLE, 256 kB flash, 16 kB RAM
    • ISP1302-BN-ZZ
      BLE, 256 kB flash, 16 kB RAM
      Delivered Pre-programmed with Serialization API
  • Prototype Packaging (ZZ = ST)
    • Delivered in unsealed standard trays or cut tapes
    • Please bake the module before assembly
  • Jedec Trays (ZZ = JT)
    • Delivered in sealed packaging
    • Only available in 100 units trays
  • Tape & Reels (ZZ = R2)
    • Delivered in sealed packaging
    • Multiple of 2000 units
  •  Storage
    • Electronic sensitive devices
  • Moisture Sensitivity
    • Level MSL-5
    • Bake 24 hours at 125°C if module stored at ambient room
  • Soldering Information
    • According to Jedec J-STD-020
    • Maximum peak temperature
      260°C / 30 sec


Insight SiP
GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

Phone: +33 (0) 493 008 880