Date : 2016-10
EDN Europe Magazine October 2016 - Complete Bluetooth LE module shrunk to 8x8x1mm
Page 41
Building on the success of its ISP1300 series modules, Insight SIP is releasing the ISP1507 to offer customers the next generation in Bluetooth Low Energy Technology in a 8x8x1mm System-in-Package.
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Date : 2016-10-03
EE Times Europe - Advanced System-in-Package design services: benefits and trades-off
Pages 32-33
The System-in-Package (SiP) concept can be defined as of integrating several heterogonous components like semiconductor and passive devices into a single package or miniaturized module. This allows for extremely rapid and low cost development cycles.
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Date : 2016-09-26
Electronics - Insight SiP announces the launch of its ISP1507 module
Insight SiP announces the launch of its ISP1507 module, extending the range of its class leading Bluetooth Smart Modules, based on the Nordic Semiconductor chipset.
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Date : 2016-09-22
Elektronik Praxis - Extrem kleines Bluetooth Smart Modul
Das ISP1507 von InsightSiP, ein Partner von tekmodul, ist mit einer Größe von nur 8 x 8 mm2 und einer Dicke von 1 mm eines der kleinsten Bluetooth Smart Module auf dem Markt. Es basiert auf dem WLCSP nRF52832 Chip von Nordic Semiconductor.
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